国家02重大专项(2016ZX02301003-004_007);国家自然科学基金项目(62074049);河北省自然科学基金项目(F2021202009)
占妮,牛新环,闫晗,罗付,屈明慧,刘江皓,邹毅达,周建伟.表面活性剂在集成电路多层布线CMP工艺中的应用研究[J].润滑与密封,2024,49(1):155-162.
ZHAN Ni, NIU Xinhuan, YAN Han, LUO Fu, QU Minghui, LIU Jianghao, ZOU Yida, ZHOU Jianwei. Research on the Application of Surfactant in CMP Process for Multi-layer Wiring of Integrated Circuits[J]. Lubrication Engineering,2024,49(1):155-162.